Heat dissipation device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S679480, C361S679520, C361S679540, C361S695000, C361S697000, C361S700000, C361S703000, C361S704000, C361S719000, C165S080300, C165S185000, C174S015200, C174S016100, C174S016300

Reexamination Certificate

active

07916469

ABSTRACT:
A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.

REFERENCES:
patent: 6625021 (2003-09-01), Lofland et al.
patent: 6945318 (2005-09-01), Ma et al.
patent: 7128135 (2006-10-01), Mok et al.
patent: 7142427 (2006-11-01), Reents
patent: 7333336 (2008-02-01), Kim
patent: 7661466 (2010-02-01), Li et al.
patent: 7757751 (2010-07-01), Zhou et al.
patent: 2008/0121371 (2008-05-01), Zhou et al.
patent: 2010/0155023 (2010-06-01), Zhou et al.
patent: 200969730 (2007-10-01), None
patent: 101409996 (2009-04-01), None

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