Wireless IC device and manufacturing method thereof

Details Wireless IC device and manufacturing method thereof Wireless IC device and manufacturing method thereof

2011-01-18

2011-01-18

Lee, Michael G (Department: 2876)

Registers

Coded record sensors

Holding devices

C235S435000, C257S678000, C257S679000, C257S700000

Reexamination Certificate

active

07871008

ABSTRACT:
A wireless IC device includes a radiation plate, a wireless IC chip, and a substrate provided with a feed circuit that includes a resonant circuit and/or the matching circuit including an inductance element and that is electromagnetically coupled to the radiation plate. The substrate is made of a resin material. A recess is provided in a first main surface of the substrate. The substrate is provided with a wiring electrode arranged along a bottom surface and an inner circumferential surface of the recess and the first main surface of the substrate and electrically connected to the feed circuit, and a wedge member made of a different material from the resin material and extending between the bottom surface of the recess and a second main surface of the substrate spaced apart from the wiring electrode. The wireless IC chip is mounted in the recess and coupled to the wiring electrode.

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