Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2011-06-07
2011-06-07
Chen, Xiaoliang (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S255000, C174S260000, C174S265000, C174S266000, C029S852000, C029S025350, C029S890100, C438S197000, C438S679000
Reexamination Certificate
active
07956292
ABSTRACT:
A printed circuit board manufacturing method includes: a hole-forming step of forming a through hole in a substrate that will become an element of a printed circuit board after manufacturing; and a jig insertion step of inserting a jig in the through hole formed in the hole-forming step such that the jig adheres to a portion of an inner wall of the through hole, the inner wall having a portion connecting to the outside of the through hole. The method further includes a conductive-film forming step of forming a conductive film only on the portion of the inner wall of the through hole connecting to the outside of the through hole, after the jig is inserted into the through hole in the jig insertion step.
REFERENCES:
patent: 5206052 (1993-04-01), Nakaso et al.
patent: 5480675 (1996-01-01), Murakami et al.
patent: 5499446 (1996-03-01), Murakami
patent: 5953629 (1999-09-01), Imazeki et al.
patent: 6120670 (2000-09-01), Nakajima
patent: 6331248 (2001-12-01), Taniguchi et al.
patent: 6339197 (2002-01-01), Fushie et al.
patent: 7183650 (2007-02-01), Shiono et al.
patent: 7193329 (2007-03-01), Takahashi
patent: 7404908 (2008-07-01), Yamaoka
patent: 7434311 (2008-10-01), Koizumi
patent: 7557445 (2009-07-01), Choi et al.
patent: 2002/0100608 (2002-08-01), Fushie et al.
patent: 2003/0121699 (2003-07-01), Happoya
patent: 2006/0268074 (2006-11-01), Hori
patent: 2007/0052067 (2007-03-01), Umemoto
patent: 2009/0117336 (2009-05-01), Usui et al.
patent: 02143588 (1990-06-01), None
patent: 2003204157 (2003-07-01), None
Chen Xiaoliang
Fujitsu Limited
Fujitsu Patent Center
LandOfFree
Printed circuit board manufacturing method, printed circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board manufacturing method, printed circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board manufacturing method, printed circuit... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2731013