Semiconductor package structure with protection bar

Details Semiconductor package structure with protection bar Semiconductor package structure with protection bar

2011-04-12

2011-04-12

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S780000, C257SE23069

Reexamination Certificate

active

07923852

ABSTRACT:
A semiconductor package structure includes a carrier, a chip or multi-chips mounted on a top surface of the carrier, a molding compound encapsulating the top surface and the chips, a plurality of solder balls distributed on a bottom surface of the carrier, and a protection bar formed of thermosetting plastic material formed on the bottom surface.

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