Fill head for full-field solder coverage with a rotatable...

Details Fill head for full-field solder coverage with a rotatable... Fill head for full-field solder coverage with a rotatable...

2011-07-19

2011-07-19

Stoner, Kiley (Department: 1735)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

C228S039000, C228S044700, C228S245000

Reexamination Certificate

active

07980445

ABSTRACT:
A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

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