Production of via hole in a flexible printed circuit board...

Details Production of via hole in a flexible printed circuit board... Production of via hole in a flexible printed circuit board...

2011-04-05

2011-04-05

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S832000, C029S825000, C029S846000, C361S720000

Reexamination Certificate

active

07918021

ABSTRACT:
A flexible circuit printable board can be favorably produced by a process composed of steps of forming in a polyimide film having a metal coat on each surface side a via hole penetrating at least one metal coat and the polyimide film; and applying a mixture of liquid and abrasive grains under pressure onto the via hole, whereby smoothing an edge of the via hole and cleaning the via hole.

REFERENCES:
patent: 5243144 (1993-09-01), Ogino et al.
patent: 5352325 (1994-10-01), Kato
patent: 5374469 (1994-12-01), Hino et al.
patent: 5436062 (1995-07-01), Schmidt et al.
patent: 5525204 (1996-06-01), Shurboff et al.
patent: 5527741 (1996-06-01), Cole et al.
patent: 5837154 (1998-11-01), Okabe et al.
patent: 6054761 (2000-04-01), McCormack et al.
patent: 6117706 (2000-09-01), Yoshioka et al.
patent: 6214923 (2001-04-01), Goto et al.
patent: 6240636 (2001-06-01), Asai et al.
patent: 6323436 (2001-11-01), Hedrick et al.
patent: 6340518 (2002-01-01), Kitahara et al.
patent: 6379223 (2002-04-01), Sun et al.
patent: 6427325 (2002-08-01), Johansson et al.
patent: 6449835 (2002-09-01), Oura et al.
patent: 6486394 (2002-11-01), Schmidt et al.
patent: 0 969 707 (2000-01-01), None
patent: 1 040 892 (2000-10-01), None
patent: 1 102 525 (2001-05-01), None
patent: 01-256194 (1989-10-01), None
patent: 09-295266 (1997-11-01), None
patent: 10-154730 (1998-06-01), None
patent: 2000-110747 (2000-04-01), None
patent: 2000-124583 (2000-04-01), None
patent: 2000-343435 (2000-12-01), None
patent: 2002-031889 (2002-01-01), None
patent: 2000-043753 (2002-02-01), None
patent: 2002-043753 (2002-02-01), None
patent: 2002-096437 (2002-04-01), None
patent: 2002-110747 (2002-04-01), None
Office Action dated Dec. 15, 2006 for Japanese Application No. JP-2002-122256 (non-English).
“Solder Mask Lamination” Research Disclosure, Kenneth Mason Publications, Hampshire, GB, No. 272, Dec. 1, 1986; p. 709.
“Fluidized Abrasive Hole—Cleaning Technique”, IBM Technique Disclosure Bulletin, IBM Corp. New York, US, vol. 32, No. 8A, 1990, pp. 39-40.
International Search Report, PCT/JP 03/05289, Jul. 14, 2003.

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