Nonvolatile semiconductor memory device and operation method...

Static information storage and retrieval – Floating gate – Particular biasing

Reexamination Certificate

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C365S185240

Reexamination Certificate

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07911852

ABSTRACT:
A p-type well region is formed at a main surface of a semiconductor substrate. An n-type impurity region is located under the p-type well region. A first insulating layer is formed on the main surface of the semiconductor substrate and on the p-type well region. A charge-storage insulating layer is formed on the first insulating layer. A gate electrode layer is formed on the charge-storage insulating layer. An erase operation is performed by applying a forward bias to the p-type well region and the n-type impurity region to generate hot carriers and inject the hot carriers into the charge-storage insulating layer.

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Lee, Chang-Hyun et al., “Charge Trapping Memory Cell of TANOS (Si-Oxide-SiN-Al2O3-TaN) Structure Compatible to Conventional NAND Flash Memory,” IEEE Nonvolatile Semiconductor Memory Workshop 2006, pp. 54-55.
Lee, Chang-Hyun et al. “A Novel SONOS Structure of SiO2/SiN/Al2O3with TaN Metal Gate for Multi-Giga Bit Flash Memories,” IEDM 2003 Tech. Digest, pp. 613-616, Dec. 2003.
Lue, Hang-Ting et al. “BE-SONOS: A Bandgap Engineered SONOS with Excellent Performance and Reliability,” IEDM 2005 Tech. Digest, pp. 555-558, Dec. 2005.
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