Predicting wafer failure using learned probability

Details Predicting wafer failure using learned probability Predicting wafer failure using learned probability

2011-06-14

2011-06-14

Kundu, Sujoy K (Department: 2857)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Quality evaluation

C702S081000, C702S083000, C702S084000, C716S136000, C700S108000, C700S109000, C700S110000

Reexamination Certificate

active

07962302

ABSTRACT:
Techniques for estimating a quality of one or more wafers are presented. One or more first wafers comprising one or more first dies are tested. A probability of wafer failure is determined in accordance with one or more first test measurements of the one or more first dies. A pass status and/or a fail status of one or more second wafers is inferred by testing a select one or more second dies of the one or more second wafers and evaluating one or more second test measurements of the select one or more second dies in accordance with the determined probability of wafer failure.

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