Mounting structure for IC tag and IC chip for mounting

Details Mounting structure for IC tag and IC chip for mounting Mounting structure for IC tag and IC chip for mounting

2011-01-11

2011-01-11

Parker, Kenneth A (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C438S365000, C438S378000

Reexamination Certificate

active

07868437

ABSTRACT:
A mounting structure for an IC tag where an IC chip for mounting (10) is mounted so as to be electrically connected to antenna patterns (44a), (44b). The assembly process that mounts the IC chip for mounting (10) on the antenna patterns (44a), (44b) is simplified, which makes it possible to reduce the manufacturing cost of IC tags. The IC chip for mounting10is formed by winding conductive wires (12a), (12b) so as to encircle an outer surface of an IC chip (20) between two opposite edges of the IC chip (20) in a state where the conductive wires (12a), (12b) mechanically contact electrodes formed on the IC chip (20) and are electrically connected to the electrodes, so that the IC chip for mounting (10) is joined to the antenna patterns (44a), (44b) via the conductive wires (12a), (12b).

REFERENCES:
patent: 6181001 (2001-01-01), Ikefuji et al.
patent: 2003/0102544 (2003-06-01), Nishikawa
patent: 2004/0219714 (2004-11-01), Yagi et al.
patent: 6252339 (1994-09-01), None
patent: 200242089 (2002-02-01), None
patent: 2000242753 (2002-09-01), None
patent: 20036600 (2003-01-01), None
patent: 2004362190 (2004-12-01), None
International Search Report of PCT/JP2005/009417, date of mailing Jul. 5, 2005.

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