Optics: measuring and testing – Dimension – Thickness
Reexamination Certificate
2011-04-26
2011-04-26
Nguyen, Sang (Department: 2886)
Optics: measuring and testing
Dimension
Thickness
C356S027000
Reexamination Certificate
active
07933027
ABSTRACT:
A computer implemented process for simultaneously measuring the velocity of terahertz electromagnetic radiation in a dielectric material sample without prior knowledge of the thickness of the sample and for measuring the thickness of a material sample using terahertz electromagnetic radiation in a material sample without prior knowledge of the velocity of the terahertz electromagnetic radiation in the sample is disclosed and claimed. Utilizing interactive software the process evaluates, in a plurality of locations, the sample for microstructural variations and for thickness variations and maps the microstructural and thickness variations by location. A thin sheet of dielectric material may be used on top of the sample to create a dielectric mismatch. The approximate focal point of the radiation source (transceiver) is initially determined for good measurements.
REFERENCES:
patent: 4056970 (1977-11-01), Sollish
patent: 4533829 (1985-08-01), Miceli et al.
patent: 4563898 (1986-01-01), Kanda et al.
patent: 5307680 (1994-05-01), Drescher-Krasicka
patent: 5549003 (1996-08-01), Drescher-Krasicka
patent: 5623145 (1997-04-01), Nuss
patent: 5710430 (1998-01-01), Nuss
patent: 5883720 (1999-03-01), Akiyama et al.
patent: 5939721 (1999-08-01), Jacobsen et al.
patent: 5974886 (1999-11-01), Carroll et al.
patent: 6495833 (2002-12-01), Alfano et al.
patent: 6810742 (2004-11-01), Sauerland
patent: 6828558 (2004-12-01), Arnone et al.
patent: 6849852 (2005-02-01), Williamson
patent: 6853926 (2005-02-01), Alfano et al.
patent: 7038208 (2006-05-01), Alfano et al.
patent: 7119339 (2006-10-01), Ferguson et al.
patent: 7145148 (2006-12-01), Alfano et al.
patent: 7174037 (2007-02-01), Arnone et al.
patent: 7214940 (2007-05-01), Cluff et al.
patent: 2004/0026622 (2004-02-01), DIMarzio et al.
patent: 2004/0095147 (2004-05-01), Cole
patent: 2004/0113103 (2004-06-01), Zhikov
patent: 2007/0090294 (2007-04-01), Safai et al.
patent: 2007/0145276 (2007-06-01), Zhang et al.
patent: 2007/0228280 (2007-10-01), Mueller
patent: 2007/0235658 (2007-10-01), Zimdars et al.
Roth, D.J., Seebo, J.P., and Winfree, W.P.“Simultaneous Non-Contact Precision Measurement of Microstructural and Thickness Variation in Dielectric Materials Using Terahertz Energy” NASA TM-2008-2148997, Mar. 2008, 2008-214997, pp. 1-18, NASA STI, http://www.sti.nasa.gov, NASA Center for AeroSpace Information (CASI) 7115 Standard Drive, Hanover, MD 21076-1320. http://gltrs.grc.nasa.gov.
Columbia Accident Investigation Board (CAIB) Report, vol. 1, Aug. 2003, pp. 1-248.
Generazio, E.R., Roth, D.J., and Stang, D.B.: “Ultrasonic Imaging of Porosity Variations Produced During Sintering” J.Am. Ceram. Soc. vol. 72, No. 7, pp. 1282-1285 1989.
Hu, B.B. and Nuss, M.C., “Imaging with Terahertz Waves,” Optics Letters, vol. 20, No. 16, p. 1716-1719, May 11, 1995, Optical Society of America.
Hsu. D.K. ct al.: “Simultaneous determination of ultrasonic velocity, plate thickness, and wedge angle using one-sided contact measurements”. NDT&E International 1994 vol. 27, No. 2, pp. 75-82, Butterworth-Heinemann Ltd.
Hull. D.R.; Kautz, H.E.; and Vary. A.: “Measurement of Ultrasonic Velocity Using Phase Slope and Cross-Correlation Methods”, Materials, Evaluation. vol. 43,. No. 11, 1985, pp. 1455-1460. Presented at the 1984 ASNT Spring Conference, May 1984, Denver, CO.
Mittleman, D.M., Jacobsen, R.H., and Nuss, M.C., “T-ray imaging,” J.Sel.Top. Quant. Elec., vol. 2, No. 3 p. 679-692 Sep. 1996, IEEE.
Mittleman, D.M., Gupta, M., Neelamani, R.G., Baraniuk, J.V., Rudd and Koch, M., “Recent advances in Terahertz imaging,” Appl. Physics. B Lasers and Optics, vol. 68. pp. 1085-1094 (1999).
Piche, L.: “Ultrasonic velocity measurement for the determination of density in polyethylene”. Polymer Engineering and Science, vol. 24, No. 17, Mid-Dec. 1984 pp. 1354-1358.
Roth, D.J.; Kiser, J.D.; Swickard, S.M., Szatmary, S., and Kerwin, D. “Quantitative Mapping of Pore Fraction Variations in Silicon Nitride Using an Ultrasonic Contact Scan Technique,” Research in Nondestructive Evaluation, NASA Technical Paper 3377, Aug. 1993, pp. 1-29, National Aeronautics and Space Administration Washington, D.C. 20546-0001.
Roth, D.J., Carney, D.V., Baaklini G.Y., Bodis, J. R., Rauser, R. W., “A Novel Ultrasonic Method for Characterizing Microstructural Gradients in Tubular Structures,” Materials Evaluation, vol. 56, No. 10, Sep. 1998 (paper submitted Apr. 1998), pp. 1053-1061.
Roth, D.J. and Farmer, D.A., “Thickness Independent Ultrasonic Imaging Applied to Abrasive Cut Off Wheels”, Materials Evaluation, vol. 58, No. 4, Apr. 2000 (submitted Jun. 1998), pp. 551-557.
Roth, D.J., Hendricks, L., Whalen. M.F. and Martin, K: “Commercial Implementation of Ultrasonic Velocity Imaging Methods via Cooperative Agreement Between NASA Lewis Research Center and Sonix, Inc.” NASA Technical Memorandum-107138, May 1996, pp. 1-40. National Aeronautics and Space Administration Washington, D.C. 20546-0001.
Winfree, W.P. and Madaras, E.I., “Detection and Characterization of Flaws in Sprayed on Foam Insulation with Pulsed Terahertz Frequency Electromagnetic Waves,” American Institute of Aeronautics and Astronautics; AIAA-2005-3629, pp. 1-8 Proceedings of the 41st AIAA/ASME/SAE/ASEE Joint Propulsion Conference & Exhibit, Tuscon. Arizona, Jul. 10-13, 2005.
Dayal, V. “An Automated Simultaneous Measurement of Thickness and Wave Speed by Ultrasound,” Experimental Mechanics, 32(3), pp. 197-202, Sep. 1992.
Inventor: Donald J. Roth, U.S. Appl. No. 12/163,382, entitled: “Simultaneous Noncontact Precision Imaging of Microstructural and Thickness Variation in Dielectric Materials Using Terahertz Energy”; Filing Date: Jun. 27, 2008.
Earp III Robert H.
Nguyen Sang
The United States of America as represented by the Administrator
Woodling Krost & Rust
LandOfFree
Processing waveform-based NDE does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Processing waveform-based NDE, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Processing waveform-based NDE will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2722775