Transfer assembly for manufacturing electronic devices

Details Transfer assembly for manufacturing electronic devices Transfer assembly for manufacturing electronic devices

2011-04-26

2011-04-26

Sells, James (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With means applying wave energy or electrical energy...

C156S542000, C156S556000

Reexamination Certificate

active

07931063

ABSTRACT:
A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.

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