High performance chip carrier substrate

Details High performance chip carrier substrate High performance chip carrier substrate

2011-01-04

2011-01-04

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

07863526

ABSTRACT:
A multilayer chip carrier with increased space for power distribution PTHs and reduced power-related noise. In a multilayer chip carrier with two signal redistribution fanout layers, in addition to signal escape from near-edge signal pads at the first fanout layer, remaining signal pads are moved closer to the edge of the chip footprint. At the voltage layer below the first fanout layer, the remaining signal pads are moved again, closer to the edge of the chip footprint. In the second fanout layer, below the voltage layer, the remaining signal pads escape. The region where signal pads are moved provides increased space for power PTHs.

REFERENCES:
patent: 5258648 (1993-11-01), Lin
patent: 6172305 (2001-01-01), Tanahashi
patent: 6351393 (2002-02-01), Kresge et al.
patent: 6373717 (2002-04-01), Downes, Jr. et al.
patent: 6479758 (2002-11-01), Arima et al.
patent: 6487088 (2002-11-01), Asai et al.
patent: 6518516 (2003-02-01), Blackwell et al.
patent: 6538213 (2003-03-01), Carden et al.
patent: 2002/0060318 (2002-05-01), Katz
patent: H03-72644 (1991-03-01), None
patent: H03-72644 (A) (1991-03-01), None
patent: 11289025 (1999-10-01), None
patent: 11289025 (A) (1999-10-01), None
patent: 2000-077819 (2000-03-01), None
patent: 2000-077819 (A) (2000-03-01), None
patent: 2000277652 (2000-10-01), None
patent: 2001326470 (2001-11-01), None
patent: 2001339009 (2001-12-01), None
patent: 2002246759 (2002-08-01), None
patent: 2003229672 (2003-08-01), None
patent: 2003318310 (2003-11-01), None
patent: 2003318310 (A) (2003-11-01), None
patent: 2005012037 (2005-01-01), None
patent: 2005012037 (A) (2005-01-01), None
patent: WO03021668 (2003-03-01), None

Affiliated with

Also associated with

Rating

High performance chip carrier substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High performance chip carrier substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High performance chip carrier substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2721311