Methods of fabricating a large area transducer array

Details Methods of fabricating a large area transducer array Methods of fabricating a large area transducer array

2011-01-11

2011-01-11

Toledo, Fernando L (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S016000, C438S019000, C257S686000, C257SE25013, C257SE21614

Reexamination Certificate

active

07867824

ABSTRACT:
Methods of fabricating a tiled transducer array are disclosed. Embodiments of the methods include fabricating a wafer comprising a plurality of transducers, dicing the wafer to form individual transducers, testing the individual transducers to identify a plurality of known good transducers, preparing a substrate having a front side and a backside wherein the backside of the substrate comprises a plurality of connectors, positioning the plurality of known good transducers on the front side of the substrate and aligning the plurality of transducers in a horizontal direction and a vertical direction to form a transducer array, and electrically coupling the connectors on the substrate to the plurality of known good transducers, wherein the connectors are arranged such that each of the plurality of known good transducers may be electrically coupled to an electronic device disposed on the backside of the substrate, through a respective one or more of the plurality of connectors.

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