Semiconductor encapsulating epoxy resin composition and semicond

Details Semiconductor encapsulating epoxy resin composition and semicond Semiconductor encapsulating epoxy resin composition and semicond

1999-05-13

2000-12-19

Dawson, Robert

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

528421, 257793, 549215, 549512, 428413, 523400, 524497, 524442, C08G 5908, C08G 5962

Patent

active

061628786

ABSTRACT:
An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.

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Flame Retardanncy of Polymeric Materials vol. 1, pp. 24-38, pp. 52-61 (Marcel Pekker Inc., New York).

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