Light emitting device having silicon-containing composition...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal

Reexamination Certificate

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Details

C438S026000, C257S079000, C428S447000, C522S099000, C522S172000

Reexamination Certificate

active

07960192

ABSTRACT:
Disclosed herein is a light emitting device including an LED die and a photopolymerizable composition comprising a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation, and from about 0.5 to about 30 parts per million of a platinum catalyst. The photopolymerizable composition may be free of catalyst inhibitor. Also disclosed herein are methods of making the light emitting device.

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U.S. Appl. No. 11/851,604, Title—Method of Making an LED Device Having a Dome Lens, filed Sep. 7, 2007.

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