Intermediate multilayer wiring board product, and method for...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C174S255000, C174S257000

Reexamination Certificate

active

07977580

ABSTRACT:
An intermediate multilayer wiring board product includes: a stack of a plurality of resin insulating layers, a first conductor layer, and a second conductor layer. The stack includes: a product forming region comprising a plurality of product portions arranged along a major surface of the stack, each of the plurality of product portions to become a product of the multilayer wiring board; and a frame portion surrounding the product forming region. The first conductor layer is formed on at least one of the plurality of resin insulating layers within each of the plurality of product portions. The second conductor layer is formed on at least one of the plurality of resin insulating layers within the frame portion. The frame portion has a plurality of cuts penetrating the frame portion in a thickness direction thereof, the plurality of cuts being arranged at substantially equal intervals.

REFERENCES:
patent: 6107179 (2000-08-01), Zomorrodi et al.
patent: 6255697 (2001-07-01), Yoo et al.
patent: 6489218 (2002-12-01), Kim et al.
patent: 6988312 (2006-01-01), Nakamura et al.
patent: 7015069 (2006-03-01), Takahashi et al.
patent: 7153724 (2006-12-01), Sirinorakul et al.
patent: 2002/0096789 (2002-07-01), Bolken
patent: 2003/0168249 (2003-09-01), Ito et al.
patent: 2005/0126818 (2005-06-01), Kojima et al.
patent: 2007/0064375 (2007-03-01), Urashima et al.
patent: 2007-180212 (2007-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Intermediate multilayer wiring board product, and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Intermediate multilayer wiring board product, and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Intermediate multilayer wiring board product, and method for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2718947

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.