Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-06-21
2011-06-21
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S621000, C257S675000, C257S706000, C257S712000, C257SE23051, C257SE23080
Reexamination Certificate
active
07964959
ABSTRACT:
A semiconductor chip, a method of fabricating the same and a stacked package having the same are disclosed. The semiconductor chip includes a wafer, a semiconductor device disposed on the wafer, an insulating layer covering the semiconductor device and disposed on the wafer, a deep via formed to penetrate the wafer and the insulating layer, and a heat dissipation member spaced at a predetermined interval from the deep via and penetrating at least a portion of the insulating layer for dissipating heat generated by the deep via.
REFERENCES:
patent: 6226183 (2001-05-01), Weber et al.
patent: 6548338 (2003-04-01), Bernstein et al.
patent: 6962867 (2005-11-01), Jackson et al.
patent: 7295441 (2007-11-01), Laio et al.
patent: 7489037 (2009-02-01), Chien et al.
patent: 2004/0201095 (2004-10-01), Palmer et al.
patent: 2004/0245630 (2004-12-01), Huang et al.
patent: 2008/0122061 (2008-05-01), Edwards
Dongbu Hi-Tek Co., Ltd.
Huynh Andy
Sherr & Vaughn, PLLC
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