Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-07-05
2011-07-05
Phan, Thiem (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S831000, C029S840000, C438S613000, C438S614000, C438S674000
Reexamination Certificate
active
07971352
ABSTRACT:
A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.
REFERENCES:
patent: 6191494 (2001-02-01), Ooyama et al.
patent: 7232755 (2007-06-01), McLellan et al.
patent: 7538022 (2009-05-01), Kurita et al.
An Jin-Yong
Hong Jong-Kuk
Jung Soon-Oh
Lee Seok-Kyu
Okabe Shuhichi
Phan Thiem
Samsung Electro-Mechanics Co. Ltd.
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