Light emitting device package and manufacture method of...

Details Light emitting device package and manufacture method of... Light emitting device package and manufacture method of...

2011-07-12

2011-07-12

Parker, Ken A (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S729000, C257S689000, C257SE33058

Reexamination Certificate

active

07977699

ABSTRACT:
A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.

REFERENCES:
patent: 6652795 (2003-11-01), Konishi et al.
patent: 6858780 (2005-02-01), Eby et al.
patent: 6858870 (2005-02-01), Lee
patent: 6881980 (2005-04-01), Ting
patent: 2004/0041757 (2004-03-01), Yang et al.
patent: 2004/0223315 (2004-11-01), Suehiro et al.
patent: 1312586 (2001-09-01), None
patent: 61-001067 (1986-01-01), None
patent: 61001067 (1986-01-01), None
patent: 10-2004-0044701 (2004-05-01), None
patent: 10-2004-0044701 (2004-05-01), None
patent: 10-2003-0051315 (2005-02-01), None
patent: 10-2005-0012372 (2005-02-01), None

Affiliated with

Also associated with

Rating

Light emitting device package and manufacture method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light emitting device package and manufacture method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting device package and manufacture method of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2717431