Method of manufacturing a semiconductor device and molding die

Details Method of manufacturing a semiconductor device and molding die Method of manufacturing a semiconductor device and molding die

2011-08-09

2011-08-09

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S112000, C438S117000, C438S127000, C257S675000, C257S706000, C257S717000, C257S796000

Reexamination Certificate

active

07993978

ABSTRACT:
A method of manufacturing a semiconductor device capable of obtaining high joining force between a heat spreader and resin is provided. The method of manufacturing a semiconductor device according to the present invention includes: setting a heat spreader60on a face formed a plurality of apertures22in a cavity21of a first molding die14; filling resin20into the cavity; setting a substrate54mounted with a semiconductor chip50a second molding die12; and pressure-welding the first molding die14and the second molding die12so that the semiconductor chip is embedded in the resin20, wherein a plurality of concave portion is formed on one face of the heat spreader60, a plurality of convex portions is formed on the other face of the heat spreader60, and the plurality of concave portions and the plurality of convex portions are overlapped in plan view.

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