Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2011-04-12
2011-04-12
Paumen, Gary F. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S079000
Reexamination Certificate
active
07922496
ABSTRACT:
A motherboard includes a motherboard substrate and an external interface module including a plurality of external interfaces. The external interface module is detachably and electrically connected to the motherboard substrate.
REFERENCES:
patent: 5454725 (1995-10-01), Speiser et al.
patent: 5576935 (1996-11-01), Freer et al.
patent: 5987531 (1999-11-01), Ikeda et al.
patent: 6341988 (2002-01-01), Zhu et al.
patent: 6659803 (2003-12-01), Chen
patent: 7354275 (2008-04-01), Chuang et al.
patent: 7566227 (2009-07-01), Li
patent: 2002/0081873 (2002-06-01), Harris et al.
patent: 2005/0079743 (2005-04-01), Hou et al.
patent: 2006/0003606 (2006-01-01), Wei-Chieh et al.
Chen Xiao-Zhu
Liu Lei
Hon Hai Precision Industry Co. Ltd.
Hong Fu Jin Precision Industry ( ShenZhen) Co., Ltd.
Ma Zhigang
Paumen Gary F.
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