Loop heat pipe and electronic device

Details Loop heat pipe and electronic device Loop heat pipe and electronic device

2011-03-29

2011-03-29

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C165S080400, C165S104260, C174S015200, C257S715000

Reexamination Certificate

active

07916482

ABSTRACT:
According to one embodiment, a loop heat pipe including a fluid circulating channel containing fluid, includes: an evaporating portion configured to vaporize the fluid by heat from a heat generating component; a condensing portion configured to liquefy the vaporized fluid; a first fluid channel connecting the evaporating portion and the condensing portion, the vaporized fluid flowing through the first fluid channel; a second fluid channel connecting the evaporating portion and the condensing portion, the fluid liquefied by the condensing portion flowing through the second fluid channel; a liquid accumulating portion formed on an inner wall of the second fluid channel, and provided between the evaporating portion and the condensing portion, the liquid accumulating portion being configured to accumulate the liquid liquefied by the condensing portion; and a wick provided between the evaporating portion and a position where the liquid accumulating portion is formed.

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Japanese Patent Application No. 2008-319942 Notice of Rejection mailed Nov. 4, 2009 (English translation).

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