Printed circuit board and heat sink

Details Printed circuit board and heat sink Printed circuit board and heat sink

2011-07-05

2011-07-05

Pape, Zachary M (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S720000, C361S709000, C361S710000, C361S719000, C165S080100, C165S185000, C174S016300, C174S252000, C257S713000

Reexamination Certificate

active

07974097

ABSTRACT:
A heat sink for a printed circuit board of power server includes at least one soldering portion. The heat sink is soldered to the printed circuit board at the soldering portion by a lead-free tin soldering process. A plurality of protruding structures protrudes from the soldering portion uniformly. The protruding structures are beneficial for getting a better soldering quality.

REFERENCES:
patent: 4254447 (1981-03-01), Griffis
patent: 4344106 (1982-08-01), West et al.
patent: 5311395 (1994-05-01), McGaha et al.
patent: 5372186 (1994-12-01), Taki et al.
patent: 6777105 (2004-08-01), Kadokawa
patent: 7599186 (2009-10-01), Gardin

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