Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2011-04-05
2011-04-05
Monbleau, Davienne (Department: 2893)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S106000, C438S108000, C438S126000, C438S128000, C438S782000, C257SE21502, C257SE21503, C228S248100
Reexamination Certificate
active
07919359
ABSTRACT:
A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.
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Fuwa Yuji
Kimura Jun-ichi
Niimi Hideki
Sakaue Tsuyoshi
Khan Farid
Monbleau Davienne
Panasonic Corporation
Wenderoth , Lind & Ponack, L.L.P.
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