Image sensor and method for manufacturing the same

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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C257SE31127

Reexamination Certificate

active

07972891

ABSTRACT:
An image sensor and a method for manufacturing the same that includes photodiodes formed in a semiconductor substrate, a first insulating layer formed over the semiconductor substrate, the first insulating layer including a seed pattern corresponding spatially to the positions of the photodiodes, lower microlenses composed of an organic material formed over the seed pattern, a second insulating layer formed over the lower microlenses, a third insulating layer formed over the second insulating layer, color filters formed over the third insulating layer, and upper micro lenses formed over the color filters.

REFERENCES:
patent: 6362498 (2002-03-01), Abramovich
patent: 7262072 (2007-08-01), Kim
patent: 7368779 (2008-05-01), Liu et al.
patent: 2006/0012001 (2006-01-01), Kim
patent: 2006/0138412 (2006-06-01), Park
patent: 2006/0255417 (2006-11-01), Kang
patent: 1862823 (2006-11-01), None
patent: 2006196626 (2006-07-01), None
patent: 10-2004-0008925 (2004-01-01), None
patent: 10-2007-0087858 (2007-08-01), None

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