Multi-layer printed circuit board and method of...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C174S262000

Reexamination Certificate

active

07999194

ABSTRACT:
Through holes36are formed to penetrate a core substrate30and lower interlayer resin insulating layers50, and via holes66are formed right on the through holes36, respectively. Due to this, the through holes36and the via holes66are arranged linearly, thereby making it possible to shorten wiring length and to accelerate signal transmission speed. Also, since the through holes36and the via holes66to be connected to solder bumps76(conductive connection pins78), respectively, are directly connected to one another, excellent reliability in connection is ensured.

REFERENCES:
patent: 4496475 (1985-01-01), Abrams
patent: 4816323 (1989-03-01), Inoue
patent: 5004639 (1991-04-01), Desai
patent: 5153986 (1992-10-01), Brauer et al.
patent: 5450290 (1995-09-01), Boyko et al.
patent: 5487218 (1996-01-01), Bhatt et al.
patent: 5557844 (1996-09-01), Bhatt et al.
patent: 5590460 (1997-01-01), DiStefano et al.
patent: 5758413 (1998-06-01), Chong et al.
patent: 5827604 (1998-10-01), Uno et al.
patent: 5837155 (1998-11-01), Inagaki et al.
patent: 5879568 (1999-03-01), Urasaki et al.
patent: 5891606 (1999-04-01), Brown
patent: 5906042 (1999-05-01), Lan et al.
patent: 6010768 (2000-01-01), Yasue et al.
patent: 6103992 (2000-08-01), Noddin
patent: 6217988 (2001-04-01), Yasue et al.
patent: 6228511 (2001-05-01), Sachdev et al.
patent: 6251502 (2001-06-01), Yasue et al.
patent: 6266874 (2001-07-01), DiStefano et al.
patent: 6323439 (2001-11-01), Kambe et al.
patent: 6376052 (2002-04-01), Asai et al.
patent: 6664485 (2003-12-01), Bhatt et al.
patent: 6729019 (2004-05-01), Grube et al.
patent: 6826830 (2004-12-01), Egitto et al.
patent: 6829823 (2004-12-01), Downes et al.
patent: 6930258 (2005-08-01), Kawasaki et al.
patent: 2002/0179335 (2002-12-01), Curcio et al.
patent: 2006/0191708 (2006-08-01), Kawasaki et al.
patent: 1140008 (1997-01-01), None
patent: 1173108 (1998-02-01), None
patent: 1182345 (1998-05-01), None
patent: 1182660 (1998-05-01), None
patent: 1199536 (2005-04-01), None
patent: 3-85686 (1991-08-01), None
patent: 07-283538 (1995-10-01), None
patent: 7-283539 (1995-10-01), None
patent: 09-130050 (1997-05-01), None
patent: 09-148748 (1997-06-01), None
patent: 09-153680 (1997-06-01), None
patent: 09-181415 (1997-07-01), None
patent: 09-260849 (1997-10-01), None
patent: 9-321434 (1997-12-01), None
patent: 9-331152 (1997-12-01), None
patent: 10-51146 (1998-02-01), None
patent: 10-200265 (1998-07-01), None
patent: 10-322024 (1998-12-01), None
patent: 10-334499 (1998-12-01), None
patent: 11-040949 (1999-02-01), None
patent: 11-177237 (1999-07-01), None
patent: 11-199759 (1999-07-01), None
patent: 11-204944 (1999-07-01), None
patent: 11-214846 (1999-08-01), None
patent: 11-266078 (1999-09-01), None
patent: 2000-165046 (2000-06-01), None
patent: 2000-244129 (2000-09-01), None
patent: 2000-299562 (2000-10-01), None
patent: 1998-7001202 (1998-04-01), None
patent: 323432 (1997-12-01), None
patent: WO 96/17503 (1996-06-01), None
patent: WO 97/16056 (1997-05-01), None
Patent Abstracts of Japan, 09-246732, Sep. 19, 1997, Kawade Masahito, Multilayer Printed Wiring Board and Manufacturing Method Thereof.
Patent Abstracts of Japan, 09-331152, Dec. 22, 1997, Kawahara Takeo, Manufacture of Circuit Board.
Patent Abstracts of Japan, 11-266078, Sep. 28, 1999, Asai Motoo, Through-Hole Filing Resin Composition and Multilayer Printed Wiring Board.
Patent Abstracts of Japan, 06-283847, Jul. 10, 1994, Ishigami Fumio, Printed Wiring Board.
Patent Abstracts of Japan, 11-087930, Mar. 30, 1999, Isao Hiroyuki, Manufacture of Multilayered Printed Circuit Board.
Patent Abstracts of Japan, 11-266079, Sep. 28, 1999, Kitamura Naoya, Buildup Multilayer Wiring Board and Manufacture Thereof.
Patent Abstracts of Japan, 11-261216, Sep. 24, 1999, Kondo Mitsuhiro, Printed Wiring Board and Its Manufacture.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi-layer printed circuit board and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer printed circuit board and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer printed circuit board and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2710494

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.