Semiconductor device

Details Semiconductor device Semiconductor device

2011-01-18

2011-01-18

Luu, Chuong A. (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S690000, C257S734000, C257S700000

Reexamination Certificate

active

07872341

ABSTRACT:
A semiconductor package comprises a plurality of stacked semiconductor chips having the same structure. Therefore, the semiconductor chips can be produced using masks of the same design, resulting in a reduction in production cost and an improvement in productivity. Each of the semiconductor chips includes a plurality of through-silicon vias penetrating therethrough. The through-silicon vias of each semiconductor chip include at least one signal pad through which a common signal is delivered to the semiconductor chip and at least one chip enable pad connected to at least one chip enable pin to select the semiconductor chip. The chip enable pin may be connected to or disconnected from the chip enable pad through a conductive line to select the semiconductor chip. The conductive line is sawn to disconnect the chip enable pin from the chip enable pad before stacking of the semiconductor chip. Therefore, the semiconductor chips can be configured to have the same design, thus eliminating the need for troublesome production management and control of the semiconductor chips.

REFERENCES:
patent: 7212422 (2007-05-01), Koide
patent: 2005/0285248 (2005-12-01), See et al.
patent: 2005-209814 (2005-08-01), None

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