Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-03-01
2011-03-01
Shosho, Callie E (Department: 1788)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000, C257SE23101, C257SE23106, C977S742000, C977S753000, C977S778000, C428S408000, C361S688000, C361S704000, C438S122000
Reexamination Certificate
active
07898079
ABSTRACT:
A heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink is provided. The heat-conducting medium can include a flexible member made from an array of interweaving carbon nanotubes. The heat-conducting medium may also include an upper surface against which a heat source may be placed, an opposing lower surface and edges about the member designed for coupling to a heat sink toward which heat from the heat source can be directed. The heat-conducting medium may also include a pad placed on the upper surface to provide structural support to the member. A method for manufacturing the heat-conducting medium is also provided.
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Brown Joseph J.
Lashmore David S.
Ducheneaux Frank D
Greenberg & Traurig, LLP
Nanocomp Technologies, Inc.
Pham Chinh H.
Shosho Callie E
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