Heat dissipation module

Details Heat dissipation module Heat dissipation module

2011-06-07

2011-06-07

Duong, Tho V (Department: 3744)

Heat exchange

With retainer for removable article

Electrical component

C165S185000, C165S104210

Reexamination Certificate

active

07954541

ABSTRACT:
A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate.

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patent: 7443680 (2008-10-01), Peng et al.

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