Method for providing and removing discharging interconnect...

Details Method for providing and removing discharging interconnect... Method for providing and removing discharging interconnect...

2011-06-07

2011-06-07

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21575, C438S694000

Reexamination Certificate

active

07955899

ABSTRACT:
Microelectronic devices may be fabricated while being protected from damage by electrostatic discharge. In one embodiment, a shorting circuit is connected to elements of the microelectronic device, where the microelectronic device is part of a chip-on-glass system. In one aspect of this embodiment, a portion of the shorting circuit is in an area of a substrate where a microchip is bonded. In another embodiment, shorting links of the shorting circuit are comprised of a fusible material, where the fusible material may be disabled by an electrical current capable of fusing the shorting links.

REFERENCES:
patent: 4714949 (1987-12-01), Simmons et al.
patent: 5019002 (1991-05-01), Holmberg
patent: 5175772 (1992-12-01), Kahn et al.
patent: 5434108 (1995-07-01), Ko et al.
patent: 5559358 (1996-09-01), Burns et al.
patent: 6034480 (2000-03-01), Browning et al.
patent: 6040937 (2000-03-01), Miles
patent: 6365433 (2002-04-01), Hyoudo et al.
patent: RE37847 (2002-09-01), Henley et al.
patent: 6543673 (2003-04-01), Lennard et al.
patent: 6567715 (2003-05-01), Sinclair et al.
patent: 6674562 (2004-01-01), Miles
patent: 6777249 (2004-08-01), Yamazaki
patent: 6950193 (2005-09-01), Discenzo
patent: 7026821 (2006-04-01), Martin
patent: 7123216 (2006-10-01), Miles
patent: 7126741 (2006-10-01), Wagner et al.
patent: 7187489 (2007-03-01), Miles
patent: 7289256 (2007-10-01), Cummings et al.
patent: 7327510 (2008-02-01), Cummings et al.
patent: 7359066 (2008-04-01), Cummings et al.
patent: 7388704 (2008-06-01), Djordjev
patent: 7411291 (2008-08-01), Baler et al.
patent: 7415186 (2008-08-01), Cummings et al.
patent: 7417735 (2008-08-01), Cummings et al.
patent: 7453579 (2008-11-01), Kothari et al.
patent: 7545556 (2009-06-01), Khazeni
patent: 7582952 (2009-09-01), Chou
patent: 2002/0157033 (2002-10-01), Cox
patent: 2002/0158348 (2002-10-01), Petrucci et al.
patent: 2006/0103643 (2006-05-01), Mathew et al.
patent: 2006/0114243 (2006-06-01), Iwasaki
patent: 2006/0243023 (2006-11-01), Wong
patent: 2008/0088638 (2008-04-01), Miles
patent: 2008/0180680 (2008-07-01), Cummings et al.
patent: 2008/0303531 (2008-12-01), Cummings et al.
patent: 0 693 781 (1996-01-01), None
Aratani et al., “Process and Design Considerations for Surface Micromachined Beams for a Tuneable Interferometer Array in Silicon,” Proc. IEEE Microelectromechanical Workshop, Fort Lauderdale, FL, pp. 230-235 (Feb. 1993).
Aratani et al., “Surface Micromachined Tuneable Interferometer Array,” Sensors and Actuators, pp. 17-23 (1994).
Conner, “Hybrid Color Display Using Optical Interference Filter Array,” SID Digest, pp. 577-580 (1993).
Durr et al., “Reliability Test and Failure Analysis of Optical MEMS”, Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits, pp. 201-206, (Jul. 8-12, 2002).
Raley et al., “A Fabry-Perot Microinterferometer for Visible Wavelengths,” IEEE Solid-State Sensor and Actuator Workshop, Hilton Head, SC (1992).
Skaggs et al, “Automatic Testing of the Digital Micromirror Device”, IEEE/LEOS 1996 Summer Topical Meetings, pp. 11-12, (Aug. 5-9, 1996).
Srikar et al., “A Critical Review of Microscale Mechanical Testing Methods Used in the Design of Microelectromechanical Systems,” Society for Experimental mechanics, vol. 43, No. 3, (2003).
ISR and WO for PCT/US07/002754 filed Feb. 1, 2007.
IPRP for PCT/US07/002754 filed Feb. 1, 2007.
Office Action dated Jan. 22, 2009 in U.S. Appl. No. 11/358,997.

Affiliated with

Also associated with

Rating

Method for providing and removing discharging interconnect... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for providing and removing discharging interconnect..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for providing and removing discharging interconnect... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2706662