Semiconductor element connected to printed circuit board

Details Semiconductor element connected to printed circuit board Semiconductor element connected to printed circuit board

2011-08-16

2011-08-16

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23017, C257SE21599, C257SE23178, C257SE23069, C257SE23077, C257SE23062, C257SE23004, C257SE23179, C257S764000, C029S834000, C029S852000, C029S832000, C361S794000, C361S795000

Reexamination Certificate

active

07999387

ABSTRACT:
A transition layer38is provided on a die pad22of an IC chip20and integrated into a multilayer printed circuit board10. Due to this, it is possible to electrically connect the IC chip20to the multilayer printed circuit board10without using lead members and a sealing resin. Also, by providing the transition layer38made of copper on an aluminum pad24, it is possible to prevent a resin residue on the pad24and to improve connection characteristics between the die pad24and a via hole60and reliability.

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