Integrated circuit packaging system with lead frame and...

Details Integrated circuit packaging system with lead frame and... Integrated circuit packaging system with lead frame and...

2011-05-31

2011-05-31

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C438S123000, C438S109000, C438S121000, C438S127000, C257S676000, C257S686000, C257S787000

Reexamination Certificate

active

07951643

ABSTRACT:
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a base device over the base substrate; attaching a leadframe having a leadframe pillar adjacent the base device over the base substrate; applying a base encapsulant over the base device, the base substrate, and the leadframe; and removing a portion of the base encapsulant and a portion of the leadframe providing the leadframe pillar partially exposed.

REFERENCES:
patent: 7034386 (2006-04-01), Kurita
patent: 7259445 (2007-08-01), Lau et al.
patent: 7381593 (2008-06-01), Ararao et al.
patent: 7476962 (2009-01-01), Kim
patent: 7719094 (2010-05-01), Wu et al.
patent: 2007/0273049 (2007-11-01), Khan et al.
patent: 2008/0105973 (2008-05-01), Zhang et al.

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