Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2011-06-21
2011-06-21
Picardat, Kevin M (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S750000, C257S758000, C438S618000, C438S637000, C438S652000
Reexamination Certificate
active
07964963
ABSTRACT:
A semiconductor package of this invention includes external electrode pad5which is formed by a conductive member that is made either of conductive resin or conductive ink, which is connected to an internal circuit of a semiconductor device, and which is to be electrically connected to an external portion, plating layer6which is provided on an entire surface of external electrode pad5, and insulating resin layer7which covers plating layer6on a peripheral edge of external electrode pad5, and which exposes a portion of plating layer6on external electrode pad5.
REFERENCES:
patent: 6605528 (2003-08-01), Lin et al.
patent: 6621164 (2003-09-01), Hwang et al.
patent: 1477704 (2004-02-01), None
patent: 1551319 (2004-12-01), None
patent: 1990284426 (1990-11-01), None
patent: 2000133683 (2000-05-01), None
patent: 2001291721 (2001-10-01), None
patent: 2002043462 (2002-02-01), None
patent: 2002208655 (2002-07-01), None
patent: 2003174118 (2003-06-01), None
patent: 2003324119 (2003-11-01), None
patent: 2005217445 (2005-08-01), None
patent: 2006057360 (2006-06-01), None
International Search Report for PCT/JP2007/069251 mailed Dec. 25, 2007.
Chinese Office Action for CN200780037348.6 dated Feb. 5, 2010.
NEC Corporation
Picardat Kevin M
LandOfFree
Semiconductor package and method for manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package and method for manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package and method for manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2701907