Determining the placement of semiconductor components on an...

Details Determining the placement of semiconductor components on an... Determining the placement of semiconductor components on an...

2011-03-29

2011-03-29

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257SE23115, C257S737000, C257S778000, C257S780000, C438S614000

Reexamination Certificate

active

07915742

ABSTRACT:
Systems and methods are disclosed herein for determining the placement of a standard cell, representing a semiconductor component in a design stage, on an integrated circuit die. One embodiment of a method, among others, comprises analyzing regions of a semiconductor die with respect to the susceptibility of the region to be exposed to radiation. This method further comprises placing the standard cell in one of the analyzed regions of the semiconductor die, the standard cell being placed based on the sensitivity of the standard cell to radiation. The method may also comprise running an algorithm, e.g. using a component placement engine, for determining the placement of semiconductor components on an integrated circuit die.

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