Multiplex communications – Communication techniques for information carried in plural... – Assembly or disassembly of messages having address headers
Reexamination Certificate
2011-06-14
2011-06-14
Ferris, Derrick W (Department: 2463)
Multiplex communications
Communication techniques for information carried in plural...
Assembly or disassembly of messages having address headers
C370S537000, C370S907000
Reexamination Certificate
active
07961757
ABSTRACT:
A device and method for interfacing with an advanced switching (AS) platform is provided. In the uplink direction the device includes: a line side interface processing module, which receives SDH/SONET frames and conducts frame header searching and descrambling; a de-framing processing module, which de-frames the descrambled frames to obtain the payloads; a packaging module, which packages the obtained payloads into AS packets according to the packet format of the AS platform and transmits the AS packets to the AS platform through the AS interface processing module. In the downlink direction the device includes: an AS interface processing module, which receives AS packets switched by the AS platform; an un-packaging module, which conducts un-packaging to obtain the payloads of the AS packets; a mapping module, which maps the payloads into SDH/SONET frames; a line side interface processing module, which scrambles the SDH/SONET frames and transmits the frames to the SDH/SONET network.
REFERENCES:
patent: 6006069 (1999-12-01), Langston
patent: 6618356 (2003-09-01), Bonaventure
patent: 2001/0012288 (2001-08-01), Yu
patent: 2003/0074449 (2003-04-01), Smith et al.
Gudmundson J: “Connect PCI express Subsystems with Advanced Switching Fabrics”, Internet Citation, [Online], May 10, 2004, XP002377103 retrieved from the Internet: URL:http://www.elecdesign.com/Articles/ArticleID/7895/7895.html> retrieved on Apr. 13, 2006, pp. 1-3, figure 3.
“Fabrics and Application Characteristics for Advancedtca Architrectures” Intel Technology Journal, XX, US, vol. 7, No. 4, Nov. 14, 2003, pp. 1-14, XP002328193 [the whole document].
Mayhew D et al.: “PCI express and advanced switching: evolutionary path to building next generation interconnects” High Performance Interconnects, 2003, Proceeding. 11thSymposium on Aug. 20-22, 2003, Piscataway, NJ, USA, IEEE, Aug. 20, 2003, pp. 21-29, XP010657970, ISBN: 0-7695-2012-X, sections 1.1, 2.1 and 3.
Wong, W: “Advanced Switching for PCI Express: The Future looks Fabric Fast” Electronic design, Penton Media, Cleveland, OH, US, vol. 51, No. 14, Jun. 23, 2003, pp. 36, 38, XP001163039 ISSN: 0013-4872 [the whole document].
Puranik, K.S.: “Advanced Switching Extends PCI Express”, XCell Journal, XX, XX, 2003, pp. 1-3, XP002328192 [the whole document].
Solomon G., et al: “Advanced Switching Architecture” Intel Developer Forum, XX, XX, Sep. 17, 2003, pp. 1-53, XP002328190, pp. 10-15, pp. 20, 21; p. 30-p. 47.
Cheng Peter
Conley & Rose, P.C.
Ferris Derrick W
Huawei Technologies Co. Ltd.
Rodolph Grant
LandOfFree
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