Method for forming bump of probe card

Details Method for forming bump of probe card Method for forming bump of probe card

2011-05-31

2011-05-31

Norton, Nadine G (Department: 1713)

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

C216S020000, C216S037000, C257S208000, C257S210000, C257S691000, C257S736000, C257S786000

Reexamination Certificate

active

07951302

ABSTRACT:
A method for forming a bump of a probe card is disclosed. In accordance with the method, a bump having a high aspect ratio for supporting a probe tip and a probe beam is formed using a semiconductor substrate as a mold eliminating a need for a photoresist film.

REFERENCES:
patent: 5134365 (1992-07-01), Okubo et al.
patent: 6127729 (2000-10-01), Fukuda
patent: 6215321 (2001-04-01), Nakata
patent: 7235413 (2007-06-01), Hasebe et al.
Cho Younghak, et al. Sensor and Actuators, A 114 (2004) pp. 327-331.

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