Method of manufacturing light emitting diode device

Details Method of manufacturing light emitting diode device Method of manufacturing light emitting diode device

2011-01-25

2011-01-25

Chen, Jack (Department: 2893)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S029000, C438S033000, C438S108000

Reexamination Certificate

active

07875471

ABSTRACT:
A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.

REFERENCES:
patent: 7195944 (2007-03-01), Tran et al.

Affiliated with

Also associated with

Rating

Method of manufacturing light emitting diode device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing light emitting diode device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing light emitting diode device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2698514