Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-06-28
2011-06-28
Arroyo, Teresa M (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S686000, C257S712000, C257S723000, C257S724000, C257SE25023, C257SE25013, C257SE23169
Reexamination Certificate
active
07968989
ABSTRACT:
A multi-package module that includes a multi-layer interconnect structure, a housing structure attached to the multi-layer interconnect structure, and a plurality of integrated circuit packages inserted into slots in the housing structure, and placed into contact with the multi-layer interconnect structure. The integrated circuit packages can be removed from the slots in the housing structure, thereby enabling testing and/or replacement of the integrated circuit packages.
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Kokozaki Camille
Shah Jitesh
Arroyo Teresa M
Bever Hoffman & Harms
Integrated Device Technology, inc
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