Semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S003000, C257S050000, C257S529000, C257SE23147

Reexamination Certificate

active

07994607

ABSTRACT:
It is an object of the present invention to provide a semiconductor device mounted with a memory which can be driven in the ranges of a current value and a voltage value which can be generated from a wireless signal. It is another object to provide a write-once read-many memory into which data can be written anytime after manufacture of a semiconductor device. An antenna, an antifuse-type ROM, and a driver circuit are formed over a substrate having an insulating surface. A stacked layer of a silicon film and a germanium film is interposed between a pair of electrodes included in the antifuse-type ROM. The antifuse-type ROM having this stacked layer can reduce fluctuation in writing voltage.

REFERENCES:
patent: 5206665 (1993-04-01), Kawade et al.
patent: 5314840 (1994-05-01), Schepis et al.
patent: 5389475 (1995-02-01), Yanagisawa et al.
patent: 5485032 (1996-01-01), Schepis et al.
patent: 5625219 (1997-04-01), Takagi
patent: 5780919 (1998-07-01), Chua et al.
patent: 5798534 (1998-08-01), Young
patent: 5929505 (1999-07-01), Takagi et al.
patent: 6034882 (2000-03-01), Johnson et al.
patent: 6051851 (2000-04-01), Ohmi et al.
patent: 6288437 (2001-09-01), Forbes et al.
patent: 6465282 (2002-10-01), Többen et al.
patent: 6528815 (2003-03-01), Brown et al.
patent: 6750530 (2004-06-01), Klaasen et al.
patent: 6828685 (2004-12-01), Stasiak
patent: 6844609 (2005-01-01), Motsiff et al.
patent: 6962844 (2005-11-01), Stasiak
patent: 6979880 (2005-12-01), Bhattacharyya et al.
patent: 7034380 (2006-04-01), Andideh
patent: 7145533 (2006-12-01), Imamura
patent: 7442997 (2008-10-01), Zhang
patent: 2003/0156449 (2003-08-01), Ooishi
patent: 2003/0183699 (2003-10-01), Masui
patent: 2003/0230746 (2003-12-01), Stasiak
patent: 2004/0026690 (2004-02-01), Bernds et al.
patent: 2004/0027849 (2004-02-01), Yang et al.
patent: 2004/0129960 (2004-07-01), Maruyama et al.
patent: 2004/0164302 (2004-08-01), Arai et al.
patent: 2004/0217441 (2004-11-01), Lehmann et al.
patent: 2005/0006640 (2005-01-01), Jackson et al.
patent: 2005/0174845 (2005-08-01), Koyama et al.
patent: 2006/0097250 (2006-05-01), Koyama et al.
patent: 2006/0175648 (2006-08-01), Asami
patent: 2006/0220252 (2006-10-01), Yukawa et al.
patent: 2006/0263634 (2006-11-01), Yamazaki
patent: 2007/0007342 (2007-01-01), Cleeves et al.
patent: 2007/0258221 (2007-11-01), Koyama et al.
patent: 0 603 105 (1994-06-01), None
patent: 0 680 087 (1995-11-01), None
patent: 1 435 653 (2004-07-01), None
patent: 56-044198 (1981-04-01), None
patent: 04-028249 (1992-01-01), None
patent: 04-373147 (1992-12-01), None
patent: 05-343633 (1993-12-01), None
patent: 06-260558 (1994-09-01), None
patent: 07-297293 (1995-11-01), None
patent: 08-078532 (1996-03-01), None
patent: 3501416 (2004-03-01), None
patent: 2004-214281 (2004-07-01), None
patent: 2005-251183 (2005-09-01), None
patent: 2006-107470 (2006-04-01), None
patent: 2006-114875 (2006-04-01), None
patent: 2007-059880 (2007-03-01), None
patent: WO 96/07300 (1996-03-01), None
patent: WO 2004/015778 (2004-02-01), None
patent: WO 2005076359 (2005-08-01), None
patent: WO 2005/096380 (2005-10-01), None
patent: WO 2005/119779 (2005-12-01), None
patent: WO 2006/028231 (2006-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2697773

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.