Semiconductor chip capable of increased number of pads in...

Details Semiconductor chip capable of increased number of pads in... Semiconductor chip capable of increased number of pads in...

2011-08-16

2011-08-16

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S780000, C257S781000, C257S782000, C257S784000, C257SE23020, C257SE23068

Reexamination Certificate

active

07999370

ABSTRACT:
A semiconductor package includes a semiconductor chip including a body unit having one or more circuit units. A first bonding pad is disposed in a first face of the body unit and is connected to a circuit unit. A second bonding pad is disposed in the first face of the body unit in the bonding pad region so as to be positioned in an adjacent surrounding area of the first bonding pad and borders at least one side face of the first bonding pad while being insulated from the first bonding pad. A first connection terminal is attached onto the first bonding pad, and a second connection terminal is attached onto the second bonding pad and is positioned in an adjacent surrounding area of the first connection terminal and borders at least one side face of the first connection terminal while being insulated from the first connection terminal.

REFERENCES:
patent: 6249051 (2001-06-01), Chang et al.
patent: 6995474 (2006-02-01), Ho et al.
patent: 7227263 (2007-06-01), Yamaguchi
patent: 7355280 (2008-04-01), Matsushima et al.
patent: 7586187 (2009-09-01), Hsu et al.
patent: 1020050047298 (2005-05-01), None
patent: 1020060036242 (2006-04-01), None

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