Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-07-12
2011-07-12
Pape, Zachary M (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679530, C361S702000, C361S724000, C361S727000, C165S080400, C165S080500, C165S104330, C174S015100, C257S714000
Reexamination Certificate
active
07978472
ABSTRACT:
Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics rack. The cooling apparatus includes a liquid-cooled cooling structure mounted to a front of the rack, and a plurality of heat transfer elements. The cooling structure is a thermally conductive material which has a coolant-carrying channel for facilitating coolant flow through the structure. Each heat transfer element couples to one or more heat-generating components of a respective electronic subsystem, physically contacts the cooling structure when that electronic subsystem is docked within the rack, and provides a thermal transport path from the heat-generating components of the electronic subsystem to the liquid-cooled cooling structure. Advantageously, electronic subsystems may be docked within or undocked from the electronics rack without affecting flow of coolant through the liquid-cooled cooling structure.
REFERENCES:
patent: 5353192 (1994-10-01), Nordin
patent: 5740018 (1998-04-01), Rumbut, Jr.
patent: 6055157 (2000-04-01), Bartilson
patent: 6351381 (2002-02-01), Bilski et al.
patent: 6388882 (2002-05-01), Hoover et al.
patent: 6411512 (2002-06-01), Mankaruse et al.
patent: 6536510 (2003-03-01), Khrustalev et al.
patent: 6657121 (2003-12-01), Garner
patent: 6796372 (2004-09-01), Bear
patent: 6836407 (2004-12-01), Faneuf et al.
patent: 7012807 (2006-03-01), Chu et al.
patent: 7312987 (2007-12-01), Konshak
patent: 7450385 (2008-11-01), Campbell et al.
patent: 7466549 (2008-12-01), Dorrich et al.
patent: 7639499 (2009-12-01), Campbell et al.
patent: 7675748 (2010-03-01), Matsushima et al.
patent: 7692924 (2010-04-01), Wavering et al.
patent: 2002/0114139 (2002-08-01), Bash et al.
patent: 2003/0128515 (2003-07-01), Faneuf et al.
patent: 2004/0150949 (2004-08-01), Belady et al.
patent: 2005/0041391 (2005-02-01), Wycraft et al.
patent: 2005/0068728 (2005-03-01), Chu et al.
patent: 2007/0291452 (2007-12-01), Gilliland et al.
patent: 2007/0297136 (2007-12-01), Konshak
patent: 0 316 129 (1989-05-01), None
patent: 6-260784 (1994-09-01), None
Berry et al., “Dockable Server Concepts”, Intel Corporation, Intel Developer Forum, pp. 1-40 (Feb. 25, 2002).
“Removable Modular Power Supply with Heat Pipes Interconnecting a Horizontally Disposed Base and a Vertically Disposed Attachment to a Cold Plate”, IBM Technical Disclosure Bulletin, p. 3062 (Dec. 1985).
Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration; International Search Report; and Written Opinion, issued by the European Patent Office for International Application No. PCT/EP2010/056452, dated Aug. 18, 2010.
Campbell Levi A.
Chu Richard C.
Ellsworth, Jr. Michael J.
Iyengar Madhusudan K.
Simons Robert E.
Heslin Rothenberg Farley & & Mesiti P.C.
International Business Machines - Corporation
Jung, Esq. Dennis
Pape Zachary M
Radigan, Esq. Kevin P.
LandOfFree
Liquid-cooled cooling apparatus, electronics rack and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Liquid-cooled cooling apparatus, electronics rack and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid-cooled cooling apparatus, electronics rack and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2697183