Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Reexamination Certificate
2011-06-07
2011-06-07
Eashoo, Mark (Department: 1767)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
C525S523000, C428S413000
Reexamination Certificate
active
07956136
ABSTRACT:
The object of the invention is to provide a resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved the object by a resin composition for semiconductor encapsulation comprising (A) an epoxy resin containing (a) an epoxy resin represented by formula (1), (B) a compound having two or more phenolic hydroxyl groups in its molecule, (C) an inorganic filler, and (D) a curing accelerator:wherein each of R1 and R2 represents a hydrogen atom or a hydrocarbon group with 4 or less carbon atoms and may be the same or different; and ‘n’ represents a mean value that is a positive number of from 0 to 5; in the formula (1).
REFERENCES:
patent: 7307128 (2007-12-01), Hayakawa et al.
patent: 2005/0069715 (2005-03-01), Hayakawa
patent: 1636987 (2005-07-01), None
patent: 07-130919 (1995-05-01), None
patent: 08-020673 (1996-01-01), None
patent: 11-001541 (1999-01-01), None
patent: 11-140277 (1999-05-01), None
patent: 11-147940 (1999-06-01), None
patent: 2001-233936 (2001-08-01), None
patent: 2003-089718 (2003-03-01), None
patent: 2003-292574 (2003-10-01), None
patent: 2005-113084 (2005-04-01), None
Eashoo Mark
McCulley Megan
Smith , Gambrell & Russell, LLP
Sumitomo Bakelite Company Ltd.
LandOfFree
Resin composition for semiconductor encapsulation and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Resin composition for semiconductor encapsulation and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition for semiconductor encapsulation and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2695979