Housing for semiconductor device

Details Housing for semiconductor device Housing for semiconductor device

1979-05-01

1980-10-28

Tolin, Gerald P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361386, 29841, H05K 720

Patent

active

042309018

ABSTRACT:
Housing for a semiconductor device includes a housing cup in which the semiconductor device is disposed, the housing cup has a bottom, at least one wall and a metal plate disposed opposite the bottom. The metal plate is thermally connected to the semiconductor device and has a mounting surface connectible to a heat sink and a lateral surface perpendicular to the mounting surface. Contacts extend from inside the housing cup through the bottom and are firmly connected thereto. Cutouts are formed in the metal plate at the edges thereof opposite said contacts. The mounting surface of the metal plate extends beyond the wall opposite the bottom. The housing is fillable with sealing compound through the cutouts to an extent where at least part of the lateral surface of the metal plate is wetted with sealing compound.

REFERENCES:
patent: 3622419 (1971-11-01), London et al.
patent: 3848077 (1974-11-01), Whitman
patent: 3906144 (1975-09-01), Wiley
patent: 3911327 (1975-10-01), Murarl et al.

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