Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2011-01-11

2011-01-11

Smith, Bradley K (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Organic semiconductor material

C257SE29309, C365S145000

Reexamination Certificate

active

07868320

ABSTRACT:
An object of the invention is to reduce an area occupied by a capacitor in a circuit in a semiconductor device, and to downsize a semiconductor device on which the capacitor and an organic memory are mounted. The organic memory and the capacitor, included in a peripheral circuit, in which the same material as the layer containing the organic compound used for the organic memory is used as a dielectric, are used. The peripheral circuit here means a circuit having at least a capacitor such as a resonance circuit, a power supply circuit, a boosting circuit, a DA converter, or a protective circuit. Further, a capacitor in which a semiconductor is used as a dielectric may be provided over the same substrate as well as the capacitor in which the same material as the layer containing the organic compound is used as a dielectric. In this case, it is desirable that the capacitor in which the same material as the layer containing the organic compound is used as a dielectric and the capacitor in which the semiconductor is used as a dielectric are connected to each other in parallel. (189)

REFERENCES:
patent: 3833894 (1974-09-01), Aviram et al.
patent: 4860254 (1989-08-01), Pott et al.
patent: 5349366 (1994-09-01), Yamazaki et al.
patent: 5375250 (1994-12-01), Van Den Heuvel
patent: 5497140 (1996-03-01), Tuttle
patent: 5883397 (1999-03-01), Isoda et al.
patent: 6013949 (2000-01-01), Tuttle
patent: 6045652 (2000-04-01), Tuttle et al.
patent: 6055180 (2000-04-01), Gudesen et al.
patent: 6133835 (2000-10-01), De Leeuw et al.
patent: 6229443 (2001-05-01), Roesner
patent: 6281552 (2001-08-01), Kawasaki et al.
patent: 6321067 (2001-11-01), Suga et al.
patent: 6331722 (2001-12-01), Yamazaki et al.
patent: 6340588 (2002-01-01), Nova et al.
patent: 6427065 (2002-07-01), Suga et al.
patent: 6525595 (2003-02-01), Oku
patent: 6528815 (2003-03-01), Brown et al.
patent: 6683322 (2004-01-01), Jackson et al.
patent: 6683802 (2004-01-01), Katoh
patent: 6741178 (2004-05-01), Tuttle
patent: 6809952 (2004-10-01), Masui
patent: 6847047 (2005-01-01), VanBuskirk et al.
patent: 6856630 (2005-02-01), Tanaka
patent: 6872969 (2005-03-01), Redecker
patent: 6894351 (2005-05-01), Okawa et al.
patent: 6950331 (2005-09-01), Yang et al.
patent: 6977389 (2005-12-01), Tripsas et al.
patent: 7050326 (2006-05-01), Anthony
patent: 7359230 (2008-04-01), Sumida et al.
patent: 7499305 (2009-03-01), Nomura et al.
patent: 2001/0026187 (2001-10-01), Oku
patent: 2003/0016133 (2003-01-01), Egbert
patent: 2003/0121985 (2003-07-01), Baldischweiler et al.
patent: 2003/0183699 (2003-10-01), Masui
patent: 2004/0026690 (2004-02-01), Bernds et al.
patent: 2004/0102176 (2004-05-01), Hayashi et al.
patent: 2004/0164302 (2004-08-01), Arai et al.
patent: 2004/0246099 (2004-12-01), Tuttle
patent: 2005/0079662 (2005-04-01), Miki
patent: 2005/0099839 (2005-05-01), Bhattacharyya
patent: 2005/0174875 (2005-08-01), Katoh
patent: 2006/0267068 (2006-11-01), Sato et al.
patent: 2007/0194301 (2007-08-01), Sezi et al.
patent: 2007/0230235 (2007-10-01), Abe et al.
patent: 2008/0048180 (2008-02-01), Abe et al.
patent: 1341186 (2003-09-01), None
patent: 1453088 (2004-09-01), None
patent: 07-022669 (1995-01-01), None
patent: 2775040 (1998-07-01), None
patent: 2000-299440 (2000-10-01), None
patent: 2001-345431 (2001-12-01), None
patent: 2004-509458 (2004-03-01), None
patent: WO-02/37500 (2002-05-01), None
patent: WO-2004/015778 (2004-02-01), None
patent: WO-2005/096380 (2005-10-01), None
patent: WO-2006/043611 (2006-04-01), None
patent: WO-2006/043687 (2006-04-01), None
Lemos, R., “RFID Tags Become Easy Target for Hacker,”, HTTP://JAPAN.CNET.COM/NEWS/SEC/STORY/02000050480,20070122,00.HTM, Jul. 29, 2007, pp. 1-3.

Affiliated with

Also associated with

Rating

Semiconductor device and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2693090