Integrated circuit package system with molding vents

Details Integrated circuit package system with molding vents Integrated circuit package system with molding vents

2011-01-04

2011-01-04

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S784000, C257SE23116, C257SE21504, C438S112000, C438S127000, C438S617000

Reexamination Certificate

active

07863761

ABSTRACT:
An integrated circuit package system comprising: providing a substrate; attaching an integrated circuit die over the substrate; attaching a connector to the integrated circuit die and the substrate; and forming an encapsulant over the substrate, the integrated circuit die, and the connector and minimizing ambient gas deformation of the substrate to keep the connector from touching another connector.

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