Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-05-03
2011-05-03
Chu, Chris (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S108000, C438S406000, C438S455000, C257SE23193, C257S678000, C257S686000, C257S688000, C361S760000, C361S761000
Reexamination Certificate
active
07935573
ABSTRACT:
The electronic device comprises a first substrate10with an electric circuit element formed in a predetermined region of one primary surface, a second substrate12formed, opposed to said one primary surface of the first substrate10, sealing portions26, 40formed between the first substrate10and the second substrate12, enclosing the predetermined region of the first substrate10, and an adhesion layer42formed on the side surfaces of the sealing parts26, 40. The adhesion layer is formed on the side surfaces of the first sealing structure26on the side of the first substrate10and the second sealing structure40on the side of the second substrate12, whereby when the first sealing structure26and the second sealing structure40are bonded to each other, the adhesion between the first sealing structure26and the second sealing structure40can be sufficiently ensured.
REFERENCES:
patent: 5355580 (1994-10-01), Tsukada
patent: 5448014 (1995-09-01), Kong et al.
patent: 5818105 (1998-10-01), Kouda
patent: 6141845 (2000-11-01), Okeshi et al.
patent: 6150748 (2000-11-01), Fukiharu
patent: 6304308 (2001-10-01), Saito et al.
patent: 6405592 (2002-06-01), Murari et al.
patent: 6441478 (2002-08-01), Park
patent: 6534901 (2003-03-01), Tsuzuki et al.
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6643920 (2003-11-01), Hori
patent: 6831725 (2004-12-01), Niiya
patent: 7122910 (2006-10-01), Nagasaki
patent: 7154206 (2006-12-01), Shimada
patent: 7248133 (2007-07-01), Koga et al.
patent: 7255823 (2007-08-01), Guenther et al.
patent: 7368321 (2008-05-01), Tomita et al.
patent: 2003/0094691 (2003-05-01), Auch et al.
patent: 2003/0137630 (2003-07-01), Niiya
patent: 2004/0217703 (2004-11-01), Wittmann et al.
patent: 2004/0251777 (2004-12-01), Yamamoto et al.
patent: 2006/0170089 (2006-08-01), Mizukoshi
patent: H04-302209 (1992-10-01), None
patent: H05-251516 (1993-09-01), None
patent: H10-079362 (1998-03-01), None
patent: H10-189819 (1998-07-01), None
patent: 2000-150557 (2000-05-01), None
patent: 3137322 (2000-12-01), None
patent: 2002-110869 (2002-04-01), None
patent: 2003-110402 (2003-04-01), None
patent: 2004-153580 (2004-05-01), None
patent: 2004-207674 (2004-07-01), None
patent: 2004-214469 (2004-07-01), None
Office Action (mailing date Sep. 18, 2007) issued by the Japanese Patent Office in connection with corresponding application No. JP 2005-022694.
USPTO, Requirement for Restriction/Election, May 20, 2008, in parent U.S. Appl. No. 11/147,451 [now abandoned].
USPTO, Non-Final Rejection, Aug. 25, 2008, in parent U.S. Appl. No. 11/147,451 [now abandoned].
USPTO, Final Rejection, Apr. 20, 2009, in parent U.S. Appl. No. 11/147,451 [now abandoned].
USPTO, Non-Final Rejection, Aug. 26, 2009, in parent U.S. Appl. No. 11/147,451 [now abandoned].
USPTO, Abandonment, Jul. 9, 2010, in parent U.S. Appl. No. 11/147,451 [now abandoned].
Chu Chris
Fujitsu Limited
Fujitsu Patent Center
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