Holding/convey jig and holding/convey method

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S729000, C029S760000, C029S831000, C269S903000

Reexamination Certificate

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07963029

ABSTRACT:
A jig for holding and conveyance includes a plate having a weak-adherence adhesive pattern on a surface and a printed circuit board having a conductive portion and a non-conductive portion on the surface of an insulating substrate. The weak-adherence adhesive pattern is formed at a position corresponding to the non-conductive portion. Alternatively, the weak-adherence adhesive pattern subjected to surface roughening is formed on a surface of the weak-adhesive layer at a position corresponding to the conductive portion.

REFERENCES:
patent: 5352324 (1994-10-01), Gotoh et al.
patent: 5972152 (1999-10-01), Lake et al.
patent: 6063647 (2000-05-01), Chen et al.
patent: 6309805 (2001-10-01), Carpenter
patent: 6458234 (2002-10-01), Lake et al.
patent: 2030779 (1980-04-01), None
patent: 63-204696 (1988-08-01), None
patent: 1-198094 (1989-08-01), None
patent: 01 287989 (1989-11-01), None
patent: 02 030196 (1990-01-01), None
patent: 04-342196 (1992-11-01), None
patent: 06-82879 (1994-11-01), None
patent: 07-099379 (1995-04-01), None
patent: 07 297522 (1995-11-01), None
patent: 9-18189 (1997-01-01), None
patent: 11-79235 (1999-03-01), None
patent: 2000-261193 (2000-09-01), None
patent: 2001-144430 (2001-05-01), None
patent: 2001-210998 (2001-08-01), None
patent: 3435157 (2003-05-01), None
Communication from European Patent Office (5 pages) including Supplementary Partial European Search Report under Rule 46(1) EPC dated Jun. 29, 2007 for corresponding Application No. 03809838.0-2214.
Communication from European Patent Office (5 pages) including Supplementary European Search Report dated Sep. 28, 2007 for corresponding Application No. 03809838.0-2214.
Japanese Patent Office Action (Decision of Rejection) mailed Jul. 22, 2003 in a corresponding Japanese patent application and English translation thereof.
Japanese Patent Office Action (Notice of Reasons for Rejection) mailed Apr. 15, 2003 in a corresponding Japanese patent application and English translation thereof.
Japanese Patent Office Action (Notice of Reasons for Rejection) mailed Sep. 24, 2002 in a corresponding Japanese patent application and English translation thereof.

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