Manufacturing method of semiconductor device

Details Manufacturing method of semiconductor device Manufacturing method of semiconductor device

2011-08-23

2011-08-23

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S464000, C257SE21519, C257SE21599

Reexamination Certificate

active

08003441

ABSTRACT:
A manufacturing method of a semiconductor device according to the present invention comprises:laminating a surface protective sheet to a circuit surface side of a wafer formed with grooves which divide each circuit wherein an adhesive film is adhered on the circuit surface of the wafer;reducing the thickness of the wafer and finally dividing the wafer into individual chips by grinding a back face of the wafer;picking up individual chips together with the adhesive film;die-bonding said individual chip to predetermined position of a chip mounting substrate via said adhesive film;fixing the chip to the chip mounting substrate by heating the die-bonded chip having the adhesive film; andapplying a static pressure larger than an ambient pressure by 0.05 MPa or more to a stacked body including the adhesive film one or more times, at any point between adhering the wafer to the adhesive film and fixing the chip to the chip mounting substrate.

REFERENCES:
patent: 5593917 (1997-01-01), Nuyen
patent: 5667884 (1997-09-01), Bolger
patent: 5840417 (1998-11-01), Bolger
patent: 5861661 (1999-01-01), Tang et al.
patent: 5888883 (1999-03-01), Sasaki et al.
patent: 6294439 (2001-09-01), Sasaki et al.
patent: 6337258 (2002-01-01), Nakayoshi et al.
patent: 6461938 (2002-10-01), Nakabayashi
patent: 6465330 (2002-10-01), Takahashi et al.
patent: 6555414 (2003-04-01), Vanfleteren et al.
patent: 6613610 (2003-09-01), Iwafuchi et al.
patent: 6756288 (2004-06-01), Feil et al.
patent: 6777313 (2004-08-01), Takyu et al.
patent: 6838316 (2005-01-01), Iizuka et al.
patent: 7060593 (2006-06-01), Kurosawa et al.
patent: 7157353 (2007-01-01), Farnworth et al.
patent: 7273768 (2007-09-01), Hwan
patent: 7285437 (2007-10-01), Silverbrook
patent: 2010/0291732 (2010-11-01), Kurita
patent: 05335411 (1993-12-01), None
patent: 0913741 (1997-08-01), None
patent: 10242208 (1998-09-01), None
patent: 10270497 (1998-10-01), None
patent: 2002118147 (2002-04-01), None
patent: 2004311709 (2004-11-01), None
patent: 2006261529 (2006-09-01), None
Patent Abstract of JP 09-213741 (Aug. 15, 1997).
Patent Abstract of JP 10-242208 (Sep. 11, 1998).
Patent Abstract of JP 10-270497 (Oct. 9, 1998).
Patent Abstract of JP 05-335411 (Dec. 17, 1993).
Patent Abstract of JP 2006261529 (Sep. 28, 2006).
Patent Abstract of JP 2002118147 (Apr. 19, 2002).
Patent Abstract of JP 2004311709 (Nov. 4, 2004).

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