Dielectric film and layer testing

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S765010, C324S760020

Reexamination Certificate

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07948259

ABSTRACT:
A system for testing and a method for making a semiconductor device is disclosed. A preferred embodiment includes a conductor overlying a dielectric layer. The conductor is coupled to a first test pad via a first conducting line and to a second test pad via a second conducting line.

REFERENCES:
patent: 6351134 (2002-02-01), Leas et al.
patent: 6902942 (2005-06-01), Wu et al.
Martin, A., et al., “Fast and Reliable WLR Monitoring Methodology for Assessing Thick Dielectrics Test Structures Integrated in the Kerf of Product Wafers,” 2002 IRW Final Report, 2002, pp. 83-87.

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