Floating subcarriers for wafer polishing apparatus

Details Floating subcarriers for wafer polishing apparatus Floating subcarriers for wafer polishing apparatus

1986-05-16

1990-04-24

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51216T, 51237R, B24B 3704

Patent

active

049188704

ABSTRACT:
A polishing apparatus has a conventional carrier with a plurality of floating subcarriers. The benefits of single wafer polishing are achieved with the economies of multiple wafer polishing by adding the plurality of floating subcarriers to the conventional carrier. Each subcarrier has a single wafer adhered to its underside. Axial freedom is provided to duplicate the dynamics of single wafer polishing. The required axial freedom is obtained by axially loading each subcarrier via a mechanical spring or via pneumatic/hydraulic devices. In two variations, each subcarrier is also allowed auto-rotational freedom. In another two variations, the subcarriers are rotationally driven. In all variations, the wafers adhered to the floating subcarriers are substantially uniformly polished and the total indicated reading of the maximum deviation on the wafer surface is improved.

REFERENCES:
patent: 3708921 (1973-01-01), Cronkhite et al.
patent: 3833230 (1974-09-01), Noll
patent: 4593495 (1986-06-01), Kawakami et al.

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